The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2010
Filed:
Apr. 26, 2007
Joong-hyun Baek, Gyeonggi-do, KR;
Sun-won Kang, Seoul, KR;
Moon-jung Kim, Gyeonggi-do, KR;
Hyung-gil Baek, Gyeonggi-do, KR;
Hee-jin Lee, Gyeonggi-do, KR;
Joong-Hyun Baek, Gyeonggi-do, KR;
Sun-Won Kang, Seoul, KR;
Moon-Jung Kim, Gyeonggi-do, KR;
Hyung-Gil Baek, Gyeonggi-do, KR;
Hee-Jin Lee, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.