The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 2010
Filed:
Sep. 14, 2006
Masashi Katsumata, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Toshikazu Endo, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A semiconductor IC-embedded modulecomprises a multilayer substratehaving first and second insulating layersand, and a controller ICand memory ICthat are embedded in the multilayer substrate. A wiring layeris formed as an internal layer in the multilayer substrate. Part of the wiring layerconstitutes a bus lineX. The controller ICor memory ICis embedded in the second insulating layer. First and second ground layersandare provided respectively in the first and second insulating layersand. The effect of noise generated by bus lines is reduced, and an additional reduction in noise and a decrease in size and thickness are achieved by laying out bus lines that connect the semiconductor ICs so that distances are minimized.