The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2010

Filed:

Mar. 07, 2008
Applicants:

George W. Banke, Jr., Essex Junction, VT (US);

Andrew Deering, Swanton, VT (US);

Philip V. Kaszuba, Essex Junction, VT (US);

Leon Moszkowicz, Milton, VT (US);

James Robert, Burlington, VT (US);

James A. Slinkman, Montpelier, VT (US);

Inventors:

George W. Banke, Jr., Essex Junction, VT (US);

Andrew Deering, Swanton, VT (US);

Philip V. Kaszuba, Essex Junction, VT (US);

Leon Moszkowicz, Milton, VT (US);

James Robert, Burlington, VT (US);

James A. Slinkman, Montpelier, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.


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