The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7811899 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 12, 2010

Filed:

Dec. 03, 2007
Applicants:

Masayuki Yamamoto, Ibaraki, JP;

Yukitoshi Hase, Kameyama, JP;

Inventors:

Masayuki Yamamoto, Ibaraki, JP;

Yukitoshi Hase, Kameyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); B23B 41/00 (2006.01); B23B 41/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece, the supporting substrate is pressed by a pressing member made of an approximately hemispherical elastic body from an approximate center of a non-adhering surface of this supporting substrate, the supporting substrate is laminated by elastically deforming this pressing member on the wafer while making the supporting substrate surface contact in a flat condition.


Find Patent Forward Citations

Yamamoto, Masayuki. (2010). Method for laminating substrate and apparatus using the method (U.S. Patent No. 7811899). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7811899

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