The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2010

Filed:

Feb. 18, 2005
Applicants:

Yukio Arimitsu, Ibaraki, JP;

Akihisa Murata, Ibaraki, JP;

Tomoko Kishimoto, Ibaraki, JP;

Inventors:

Yukio Arimitsu, Ibaraki, JP;

Akihisa Murata, Ibaraki, JP;

Tomoko Kishimoto, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 33/00 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×10Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×10Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.


Find Patent Forward Citations

Loading…