The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2010

Filed:

Dec. 21, 2007
Applicants:

Yoshifumi Kamano, Fuji, JP;

Hajime Mochizuki, Fuji, JP;

Shingo Yanagibashi, Fuji, JP;

Norio Hayakawa, Fuji, JP;

Enda Clarke, Swords, IE;

Yasunori Sei, Fuji, JP;

Inventors:

Yoshifumi Kamano, Fuji, JP;

Hajime Mochizuki, Fuji, JP;

Shingo Yanagibashi, Fuji, JP;

Norio Hayakawa, Fuji, JP;

Enda Clarke, Swords, IE;

Yasunori Sei, Fuji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B62D 25/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

An instrument panel includes a panel body and a joint member. The panel body includes a core member and an outer layer that covers the core member, and is formed by reaction injection molding. The panel body includes a meter installed portion. A recess of the meter installed portion becomes an undercut at the time of molding. A core member is provided with a deformable portion which is elastically deformable. The molded panel body can be demolded by deforming the deformable portion. There is no need to provide a slide core with a molding die. A deformation of the deformable portion is prevented by installing the joint member onto the demolded panel body. According to the instrument panel, it is possible to improve a product quality and reduce manufacturing cost.


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