The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Sep. 10, 2007
Hidefumi Hatanaka, Kirishima, JP;
Tsutomu Adachi, Kirishima, JP;
Youichi Yokote, Kirishima, JP;
Miho Imashioya, Kirishima, JP;
Tomohiko Taniguchi, Higashiomi, JP;
Hidefumi Hatanaka, Kirishima, JP;
Tsutomu Adachi, Kirishima, JP;
Youichi Yokote, Kirishima, JP;
Miho Imashioya, Kirishima, JP;
Tomohiko Taniguchi, Higashiomi, JP;
Kyocera Corporation, Kyoto, JP;
Kyocera Kinseki Corporation, Tokyo, JP;
Abstract
An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.