The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Jun. 29, 2007
Kevin M. Gertiser, Carmel, IN (US);
Richard A. Ripple, Westfield, IN (US);
Michael J. Lowry, Indianapolis, IN (US);
Karl A. Schten, Kokomo, IN (US);
Ronald M. Shearer, Kokomo, IN (US);
Jim M. Spall, Carmel, IN (US);
Kevin M. Gertiser, Carmel, IN (US);
Richard A. Ripple, Westfield, IN (US);
Michael J. Lowry, Indianapolis, IN (US);
Karl A. Schten, Kokomo, IN (US);
Ronald M. Shearer, Kokomo, IN (US);
Jim M. Spall, Carmel, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.