The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
May. 29, 2008
Akimi Saiki, Kawasaki, JP;
Hiroyuki Shoji, Kawasaki, JP;
Gousuke Takahashi, Hitachi, JP;
Noriyuki Hasegawa, Hitachi, JP;
Fumio Takano, Hitachi, JP;
Kouji Sato, Yonezawa, JP;
Akimi Saiki, Kawasaki, JP;
Hiroyuki Shoji, Kawasaki, JP;
Gousuke Takahashi, Hitachi, JP;
Noriyuki Hasegawa, Hitachi, JP;
Fumio Takano, Hitachi, JP;
Kouji Sato, Yonezawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Hitachi Cable Precision Co., Ltd., Yamagata, JP;
Abstract
The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.