The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Nov. 15, 2006
Hiroyuki Ozaki, Tokyo, JP;
Hisashi Kawafuji, Tokyo, JP;
Shinya Nakagawa, Fukuoka, JP;
Kenichi Hayashi, Tokyo, JP;
Hiroyuki Ozaki, Tokyo, JP;
Hisashi Kawafuji, Tokyo, JP;
Shinya Nakagawa, Fukuoka, JP;
Kenichi Hayashi, Tokyo, JP;
Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;
Abstract
A semiconductor device includes a pair of power chips, an IC chip, a plurality of leads one of which having a die pad on which the power chips are mounted and another one having a die attach portion on which the IC chip is mounted, a resin sheet firmly adhered to one side of the die pad, and a resin casing made by molding operation to encapsulate the power chips, the IC chip and the resin sheet by a resin in such a manner that one surface of the resin sheet opposite the die pad is exposed to the exterior of the resin casing. The resin casing has a groove formed in one surface opposite the exposed surface of the resin sheet, the groove extending parallel to the resin sheet and perpendicular to a runner through which the resin was supplied in the molding operation.