The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Mar. 17, 2006
Tsung-ting Sun, Chung-Ho, TW;
Hung-ta Laio, Chung-Ho, TW;
Hung-hsun Chou, Chung-Ho, TW;
Tz-shiuan Yan, Chung-Ho, TW;
Kuo-shih Hsu, Chung-Ho, TW;
Tsung-Ting Sun, Chung-Ho, TW;
Hung-Ta Laio, Chung-Ho, TW;
Hung-Hsun Chou, Chung-Ho, TW;
Tz-Shiuan Yan, Chung-Ho, TW;
Kuo-Shih Hsu, Chung-Ho, TW;
Edison Opto Corporation, Taipei, TW;
Abstract
A light emitting diode package structure having a heat-resistant cover and a method of manufacturing the same include a base, a light emitting diode chip, a plastic shell, and a packaging material. The plastic shell is in the shape of a bowl and has an injection hole thereon. After the light emitting diode chip is installed onto the base, the plastic shell is covered onto the base to fully and air-tightly seal the light emitting diode chip, and the packaging material is injected into the plastic shell through the injection hole until the plastic shell is filled up with the packaging material to form a packaging cover, and finally the plastic shell is removed to complete the LED package structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile