The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2010

Filed:

Oct. 28, 2005
Applicants:

Manabu Shiozaki, Osaka, JP;

Keiji Fuse, Osaka, JP;

Kenichi Watatani, Osaka, JP;

Inventors:

Manabu Shiozaki, Osaka, JP;

Keiji Fuse, Osaka, JP;

Kenichi Watatani, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

Ultrashort pulse laser processing bores, welds or cuts objects (work pieces) by converging ultrashort laser pulses by a lens on the objects (work pieces) positioned at the focus and heating small spots or narrow lines on the objects (work pieces). Shortage of a focal depth of the lens prevents the ultrashort pulse laser processing from positioning the object (a work piece) and forming a deep, constant-diameter cylindrical hole. Z-parameter is defined to be Z=2fcΔt/Δi, where Δt is a FWHM pulse width of the ultrashort pulse laser, Δi is a FWHM beam diameter of the ultrashort pulse, f is a focal length of the lens and c is the light velocity in vacuum. Selection of an optical system including a diffraction-type lens which gives the Z-parameter less than 1 (Z<1) prolongs the focal depth. Expansion of the focal depth facilitates the positioning of objects (work pieces) and enables the ultrashort pulse laser apparatus to bore a deep, constant-diameter cylindrical hole.


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