The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Mar. 09, 2004
Franz Auerbach, Soest, DE;
Bernd Gutsmann, Weyhe, DE;
Thomas Licht, Warstein, DE;
Norbert Seliger, München, DE;
Karl Weidner, München, DE;
Jörg Zapf, München, DE;
Franz Auerbach, Soest, DE;
Bernd Gutsmann, Weyhe, DE;
Thomas Licht, Warstein, DE;
Norbert Seliger, München, DE;
Karl Weidner, München, DE;
Jörg Zapf, München, DE;
Siemens Aktiengesellschaft, Munich, DE;
Abstract
In an arrangement having at least one substrate, at least one electrical component is disposed on a surface section of the substrate and is provided with an electrical contact area, and at least one electrical contact lug has an electrical connecting area electrically contacting the contact area of the component. The connecting area of the contact lug and the contact area of the component are interconnected so that at least one zone of the contact lug protrudes beyond the area of the component. The contact lug is provided with at least one electrically conducting film while the electrically conducting film is provided with the electrical connecting area of the contact lug. The arrangement is particularly useful for large-area, low-inductive contacting of power semiconductor chips, as it allows for high current density.