The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Nov. 15, 2004
Toshiaki Masuda, Yao, JP;
Takashi Fujie, Yao, JP;
Ichiro Takahara, Yao, JP;
Ikuo Yosejima, Yao, JP;
Katsushi Miki, Yao, JP;
Toshiaki Masuda, Yao, JP;
Takashi Fujie, Yao, JP;
Ichiro Takahara, Yao, JP;
Ikuo Yosejima, Yao, JP;
Katsushi Miki, Yao, JP;
Matsumoto Yushi-Seiyaku Co., Ltd., Yao-Shi, JP;
Abstract
A production process for heat-expanded microspheres includes the step of providing a gaseous fluid containing heat-expandable microspheres, which includes a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 μm. The gaseous fluid is fed through a gas-introducing tube having a dispersion nozzle on its outlet that is fixed inside a conduit having a hot gas flow flowing therethrough. A jet of the gaseous fluid is emitted through the dispersion nozzle. Further, the gaseous fluid is collided on a collision plate fixed under the dispersion nozzle so as to disperse the heat-expandable microspheres in the hot gas flow. The dispersed heat-expandable microspheres are heated in the hot gas flow at a temperature not lower than their expansion initiating temperature and thus expanded.