The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Sep. 21, 2006
Jong Jin Lee, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Jae Min Choi, Daejeon, KR;
Chang Yul OH, Daejeon, KR;
Jong Jin Lee, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Jae Min Choi, Daejeon, KR;
Chang Yul Oh, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
Disclosed herein is a method of manufacturing a copper-clad laminate for Via-On-Pad application. The pad includes the steps of providing a first copper foil layer and a second copper foil layer, on the first surfaces of which protective layers are formed; placing two sets of a first copper foil layer, an insulating layer and a second copper foil layer above and below an adhesive layer, respectively; removing the protective layers, which have been respectively formed on the second copper foil layers, and parts of the second copper foil layers; forming via holes by removing parts of the insulating layers through the regions from which the parts of the second copper foil layers have been removed, using laser processing; and forming two copper-clad laminates by removing the protective layers, which have been respectively formed on one surface of one first copper foil layer and one surface of the other first copper foil layer, and the adhesive layer.