The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
Oct. 13, 2005
Tsukasa Ikeda, Fukushima, JP;
Yasuhiro Suzuki, Fukushima, JP;
Kenichi Iwabuchi, Fukushima, JP;
Takumi Katsurao, Tokyo, JP;
Tsukasa Ikeda, Fukushima, JP;
Yasuhiro Suzuki, Fukushima, JP;
Kenichi Iwabuchi, Fukushima, JP;
Takumi Katsurao, Tokyo, JP;
Kureha Corporation, Tokyo, JP;
Abstract
Polyvinylidene fluoride resin powder for melt molding, which exhibits such particle size distribution characteristics that the average particle diameter (D) is 80 to 250 μm, the proportion of resin powder having a particle diameter of at most 45 μm is at most 15.0% by weight, and the proportion of resin powder having a particle diameter of at least 355 μm is at most 10.0% by weight, and has a bulk density of 0.30 to 0.80 g/cmand an angle of repose of at most 40°, and a process for producing a molding, which comprises feeding the resin powder to an injection molding machine or extrusion molding machine, melting the resin powder, and injecting the resin melt into a mold.