The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2010
Filed:
May. 11, 2007
Kazuhito Kurose, Yamamashi, JP;
Yukihiro Hirata, Yamanashi, JP;
Tomoyuki Ozasa, Yamananshi, JP;
Hisanori Terui, Yamanashi, JP;
Kazuhito Kurose, Yamamashi, JP;
Yukihiro Hirata, Yamanashi, JP;
Tomoyuki Ozasa, Yamananshi, JP;
Hisanori Terui, Yamanashi, JP;
Kitz Corporation, Chiba, JP;
Abstract
A copper-based alloy essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0<Se≦0.35 wt %, 0<P≦0.5, one of 0<Sb≦2.2 wt % and 0<Ni≦4.8 wt %, and a balance of Cu and unavoidable impurities. It may essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0≦Se≦0.35 wt %, 0<P<0.5 wt %, one of 0<Sb≦2.2 wt % and 0<Ni≦4.8 wt %, 1.20 to 4.90 Vol. % of at least one selected from the group consisting of a non-solid solution substance secured with Bi and a non-solid solution secured with Bi and Se, and a balance of Cu and unavoidable impurities.