The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 2010

Filed:

May. 14, 2007
Applicants:

Erich Syri, Wenzenbach, DE;

Gerold Gruendler, Regensburg, DE;

Juergen Hoegerl, Regensburg, DE;

Thomas Killer, Hohenschambach, DE;

Volker Strutz, Tegernheim, DE;

Inventors:

Erich Syri, Wenzenbach, DE;

Gerold Gruendler, Regensburg, DE;

Juergen Hoegerl, Regensburg, DE;

Thomas Killer, Hohenschambach, DE;

Volker Strutz, Tegernheim, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.


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