The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Apr. 27, 2006
Hans M. B. Boeve, Hechtel-Eksel, BE;
Teunis J. Ikkink, Geldrop, NL;
Nicolaas J. A. Van Veen, Geldrop, NL;
Hans M. B. Boeve, Hechtel-Eksel, BE;
Teunis J. Ikkink, Geldrop, NL;
Nicolaas J. A. Van Veen, Geldrop, NL;
NXP B.V., Eindhoven, NL;
Abstract
A device () comprising a sensor module () with a package () is produced at reduced costs by providing the package () with two or more substrates () each with a functional layer (), at least one sensor () such as a magnetometer and/or an accelerometer being located in at least one functional layer (), and by providing the package () with a system comprising solder bumps (-) for aligning the functional layers (). The system either comprises a first number of solder bumps () for coupling the functional layers () electrically and mechanically to each other via first bonding elements () or comprises a third substrate () with a third functional layer () and a second number of solder bumps () for coupling the first and third functional layers () electrically and mechanically to each other via second bonding elements () and a third number of solder bumps () for coupling the second and third functional layers () electrically and mechanically to each other via third bonding elements (). Mechanically and/or electrically dummy solder bumps improve the alignment of the functional layers ().