The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Jun. 30, 2004
Yoshihiko Shimanuki, Nanyou, JP;
Yoshihiko Shimanuki, Nanyou, JP;
Renesas Electronics Corporation, Kawasaki, JP;
Hitachi Yonezawa Electronics Co., Ltd., Yonezawa, JP;
Abstract
A semiconductor device is disclosed which includes a tab () for use in supporting a semiconductor chip (), a seal section () as formed by sealing the semiconductor chip () with a resin material, more than one tab suspension lead () for support of the tab (), a plurality of electrical leads () which have a to-be-connected portion as exposed to outer periphery on the back surface of the seal section () and a thickness reduced portion as formed to be thinner than said to-be-connected portion and which are provided with an inner groove () and outer groove () in a wire bonding surface () as disposed within the seal section () of said to-be-connected portion, and wires () for electrical connection between the leads () and pads () of the semiconductor chip (), wherein said thickness reduced portion of the leads () is covered by or coated with a sealing resin material while causing the wires () to be contacted with said to-be-connected portion at specified part lying midway between the outer groove () and inner groove () to thereby permit said thickness reduced portion of leads () and the outer groove () plus the inner groove () to prevent occurrence of any accidental lead drop-down detachment.