The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Jun. 02, 2004
Yasushi Hasegawa, Futtsu, JP;
Ryuichi Honma, Futtsu, JP;
Yutaka Takagi, Hashima, JP;
Nippon Steel Corporation, Tokyo, JP;
Fukuju Industry Corporation Ltd, Gifu, JP;
Abstract
A liquid phase diffusion bonding method for a metal machine part superior in the quality of the joint and the productivity enabling the bonding time to be shortened, achieving homogenization of the bonding structure and improving the tensile strength, fatigue strength, and joint quality and reliability. This liquid phase diffusion bonding method of a metal machine part is characterized interposing an amorphous alloy foil for liquid phase diffusion bonding at bevel faces of metal materials, performing primary bonding by melt bonding said amorphous alloy foil and said metal material by resistance welding to form a joint, then performing secondary bonding by liquid phase diffusion bonding by reheating said joint to at least the melting point of said amorphous alloy foil, then holding it there to complete the solidification process of said joint.