The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Jun. 14, 2007
Thomas J. Hagman, Seattle, WA (US);
Ralph D. Cope, Elkton, MD (US);
Ross Hutter, Lincoln University, PA (US);
Steven A. Cope, Newark, DE (US);
Kim Ferrara, Middletown, DE (US);
Nanette M. Gopez, Newark, DE (US);
Michael J. Case, Bear, DE (US);
Thomas J. Hagman, Seattle, WA (US);
Ralph D. Cope, Elkton, MD (US);
Ross Hutter, Lincoln University, PA (US);
Steven A. Cope, Newark, DE (US);
Kim Ferrara, Middletown, DE (US);
Nanette M. Gopez, Newark, DE (US);
Michael J. Case, Bear, DE (US);
Boeing Company, Chicago, IL (US);
Abstract
An apparatus for splicing an elongate multi-layered workpiece includes: (a) drives and guides cooperating to drive the workpiece along a working path; (b) a cutter for severing the workpiece; (c) a layer manipulator for separating layers; (d) an applicator for applying adhesive; and (e) a deflector unit for deflecting the workpiece from the working path. The cutter effects the severing to present first and second workpiece segments. The layer manipulator effects inter-layer separation in one segment to present an interlayer zone in the one segment. A drive inserts the other segment in the interlayer zone. The layer manipulator urges the layers together to capture the other segment within the interlayer zone to establish a multi-layer structure. A drive and at least one of the workpiece deflector unit and the applicator situate the multi-layer structure adjacent to the applicator for finishing the splicing by applying adhesive to the multi-layer structure.