The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2010
Filed:
Apr. 01, 2005
Don W. Arnold, Livermore, CA (US);
Kenneth R. Hencken, Pleasanton, CA (US);
Sammy S. Datwani, Dublin, GB;
Patrick Pak-ho Leung, Belmont, CN;
Douglas R. Cyr, Livermore, CA (US);
Jason E. Rehm, Alameda, CA (US);
Don W. Arnold, Livermore, CA (US);
Kenneth R. Hencken, Pleasanton, CA (US);
Sammy S. Datwani, Dublin, GB;
Patrick Pak-Ho Leung, Belmont, CN;
Douglas R. Cyr, Livermore, CA (US);
Jason E. Rehm, Alameda, CA (US);
AB Sciex LLC, Framingham, MA (US);
Abstract
A junction is made between a first microfluidic substrate () having an elongate component () protruding from it and a second microfluidic substrate () having a corresponding conduit (). Each of the substrates has a pair of alignment features, for example planar orthogonal surfaces () or grooves () in opposite sides of the substrate. The substrates are placed on an alignment jighaving location features () corresponding to the alignment features. The elongate component can be surrounded by a compressible gasket). The substrates are pushed towards each other so that the elongate component enters the conduit and the gasket, if any, is compressed. A fluid-tight junction results so long as the substrates are maintained in the necessary position, either by permanent means, or, if a junction which can be disassembled is needed, by maintaining pressure between the substrates. Novel apparatus and novel microfluidic assemblies, including microfluidic chips having grooves in their sides, are described.