The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Jun. 16, 2006
Applicant:
Yun-han Chen, Hsinchu, TW;
Inventor:
Yun-Han Chen, Hsinchu, TW;
Assignee:
Via Technologies, Inc., Hsin Tien, Taipei Hsien, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A ball grid array (BGA) package includes a substrate and a chip. A bottom surface of the substrate includes a central area and a marginal area. Several source balls are disposed in the central area. Several ball groups are disposed in the marginal area. Each ball group includes one ground ball and at most three signal balls. The chip is disposed on a top surface of the substrate and electrically connected to the substrate.