The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Dec. 28, 2007
Joo-sang Lee, Bucheon-si, KR;
O-seob Jeon, Seoul, KR;
Yong-suk Kwon, Bucheon-si, KR;
Frank Chen, Suzhou, CN;
Adams Zhu, Suzhou, CN;
Joo-sang Lee, Bucheon-si, KR;
O-seob Jeon, Seoul, KR;
Yong-suk Kwon, Bucheon-si, KR;
Frank Chen, Suzhou, CN;
Adams Zhu, Suzhou, CN;
Fairchild Korea Semiconductor, Ltd., Bucheon-si, KR;
Abstract
A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.