The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2010

Filed:

Jan. 08, 2007
Applicants:

Yukihiro Kozaka, Kyoto, JP;

Nozomi Shimoishizaka, Kyoto, JP;

Toshiyuki Fukuda, Kyoto, JP;

Inventors:

Yukihiro Kozaka, Kyoto, JP;

Nozomi Shimoishizaka, Kyoto, JP;

Toshiyuki Fukuda, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/488 (2006.01); H01L 21/44 (2006.01); H05K 3/18 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board includes a film base, a plurality of conductive wirings aligned on the film base, and protrusion electrodes formed of a plated metal in the vicinity of end portions of the conductive wirings, respectively. An outer surface at both side portions of the protrusion electrodes in cross section in a width direction of the conductive wirings defines a curve, and the protrusion electrodes in cross section in a longitudinal direction of the conductive wirings define a rectangular shape. The conductive wirings include a first conductive wiring having a wiring width of Wand a second conductive wiring having a wiring width of Wlarger than W, and the protrusion electrode on the first conductive wiring and the protrusion electrode on the second conductive wiring have a substantially same height. The wiring board is capable of supporting conductive wirings with a practically enough strength to withstand a stress applied during the connection between the protrusion electrodes of the film base and electrode pads of a semiconductor element, providing sufficient connection stability and coping with a narrow pitch of the semiconductor element.


Find Patent Forward Citations

Kozaka, Yukihiro. (2010). Wiring board with conductive wirings and protrusion electrodes (U.S. Patent No. 7800209). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7800209

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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