The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Mar. 06, 2008
Applicant:
Sung Ho Hyun, Seoul, KR;
Inventor:
Sung Ho Hyun, Seoul, KR;
Assignee:
Hynix Semiconductor Inc., Kyoungki-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A thinned wafer having stress dispersion parts that make the wafer resistant to warpage and a method for manufacturing a semiconductor package using the same is described. The wafer includes a wafer body having a semiconductor chip forming zone and a peripheral zone located around the semiconductor chip forming zone; and the stress dispersion parts are located in the peripheral zone so as to disperse stress induced in the peripheral zone and the semiconductor chip forming zone.