The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2010

Filed:

Jul. 25, 2005
Applicants:

Jean-michel Reynes, Pompertuzat, FR;

Stephane Alves, Toulouse, FR;

Alain Deram, Colomiers, FR;

Blandino Lopes, Auzeville Tolosane, FR;

Joel Margheritta, Seysses, FR;

Inventors:

Jean-Michel Reynes, Pompertuzat, FR;

Stephane Alves, Toulouse, FR;

Alain Deram, Colomiers, FR;

Blandino Lopes, Auzeville Tolosane, FR;

Joel Margheritta, Seysses, FR;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor power switch having an array of basic cells in which peripheral regions in the active drain region extend beside the perimeter of the base-drain junction, the peripheral regions being of higher dopant density than the rest of the second drain layer. Intermediate regions in the centre of the active drain region are provided of lighter dopant density than the rest of the second drain layer. This provides an improved compromise between the on-state resistance and the breakdown voltage by enlarging the current conduction path at in its active drain region. On the outer side of each edge cell of the array, the gate electrode extends over and beyond at least part of the perimeters of the base-source junction and the base-drain junction towards the adjacent edge of the die. Moreover, on the outer side of each edge cell, the second drain layer includes a region of reduced dopant density that extends beyond the gate electrode right to the adjacent edge of the die.


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