The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 2010

Filed:

Dec. 05, 2007
Applicants:

Seong Deok Ahn, Daejeon, KR;

Seung Youl Kang, Daejeon, KR;

Chul AM Kim, Seoul, KR;

Ji Young OH, Daejeon, KR;

IN Kyu You, Daejeon, KR;

Gi Heon Kim, Daejeon, KR;

Kyu Ha Baek, Daejeon, KR;

Kyung Soo Suh, Daejeon, KR;

Inventors:

Seong Deok Ahn, Daejeon, KR;

Seung Youl Kang, Daejeon, KR;

Chul Am Kim, Seoul, KR;

Ji Young Oh, Daejeon, KR;

In Kyu You, Daejeon, KR;

Gi Heon Kim, Daejeon, KR;

Kyu Ha Baek, Daejeon, KR;

Kyung Soo Suh, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a method for depositing an organic/inorganic thin film. The method includes: i) heating a source vessel containing an organic material and an inorganic material; ii) transferring a deposition gas to a process chamber; iii) distributing the deposition gas onto a substrate disposed in the process chamber; iv) purging the process chamber; v) heating an activating agent source vessel; vi) transferring a heat initiator gas phase to the process chamber; vii) distributing the heat initiator gas phase onto the organic or inorganic material monomer deposited on the substrate through the process chamber, and forming an organic/inorganic thin film; and viii) exhausting the heat initiator gas phase and purging the process chamber. Depositing the organic/inorganic thin film in a time-division manner, the thickness of the thin film can be accurately adjusted and the deposition can be uniformly performed when the thin film is deposited on a large-scale substrate.


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