The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Apr. 04, 2007
Steven C. Bird, San Jose, CA (US);
Varoujan Malian, San Jose, CA (US);
Mudasir Ahmad, Santa Clara, CA (US);
Charles H. Casale, San Jose, CA (US);
Danlu Tang, Cupertino, CA (US);
Steven C. Bird, San Jose, CA (US);
Varoujan Malian, San Jose, CA (US);
Mudasir Ahmad, Santa Clara, CA (US);
Charles H. Casale, San Jose, CA (US);
Danlu Tang, Cupertino, CA (US);
Cisco Technology, Inc., San Jose, CA (US);
Abstract
Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.