The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Mar. 09, 2009
Randy H. Wiles, Powell, TN (US);
Andrew A. Wereszczak, Oak Ridge, TN (US);
Curtis W. Ayers, Kingston, TN (US);
Kirk T. Lowe, Knoxville, TN (US);
Randy H. Wiles, Powell, TN (US);
Andrew A. Wereszczak, Oak Ridge, TN (US);
Curtis W. Ayers, Kingston, TN (US);
Kirk T. Lowe, Knoxville, TN (US);
UT-Battelle, LLC, Oak Ridge, TN (US);
Abstract
The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.