The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2010

Filed:

Dec. 20, 2006
Applicants:

Yoshio Yamada, Nagano, JP;

Hiroshi Nakayama, Nagano, JP;

Mitsuhiro Nagaya, Nagano, JP;

Shogo Imuta, Nagano, JP;

Inventors:

Yoshio Yamada, Nagano, JP;

Hiroshi Nakayama, Nagano, JP;

Mitsuhiro Nagaya, Nagano, JP;

Shogo Imuta, Nagano, JP;

Assignee:

NHK Spring Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer.


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