The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Jul. 15, 2009
Jonathan James Lynch, Oxnard, CA (US);
James H. Schaffner, Chatsworth, CA (US);
Daniel Frederic Sievenpiper, Los Angeles, CA (US);
Debabani Choudhury, Thousand Oaks, CA (US);
Joseph Colburn, Malibu, CA (US);
Joel N. Schulman, Malibu, CA (US);
Harris P. Moyer, Los Angeles, CA (US);
Andrew T. Hunter, Woodland Hills, CA (US);
Jonathan James Lynch, Oxnard, CA (US);
James H. Schaffner, Chatsworth, CA (US);
Daniel Frederic Sievenpiper, Los Angeles, CA (US);
Debabani Choudhury, Thousand Oaks, CA (US);
Joseph Colburn, Malibu, CA (US);
Joel N. Schulman, Malibu, CA (US);
Harris P. Moyer, Los Angeles, CA (US);
Andrew T. Hunter, Woodland Hills, CA (US);
HRL Laboratories, LLC, Malibu, CA (US);
Abstract
Low cost millimeter wave imagers using two-dimensional focal plane arrays based on backward tunneling diode (BTD) detectors. Two-dimensional focal arrays of BTD detectors are used as focal plane arrays in imagers. High responsivity of BTD detectors near zero bias results in low noise detectors that alleviate the need for expensive and heat generating low noise amplifiers or Dicke switches in the imager. BTD detectors are installed on a printed circuit board using flip chip packaging technology and horn antennas direct the waves toward the flip chip including the BTD detectors. The assembly of the horn antennas, flip chips, printed circuit board substrate, and interconnects together work as an imaging sensor. Corrugated surfaces of the components prevent re-radiation of the incident waves.