The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Mar. 06, 2007
Gi Ho Jeong, Busan, KR;
Jae Wook Kwon, Seoul, KR;
Dong Jin Kim, Seoul, KR;
Yoon Tak Yang, Hwaseong-si, KR;
Hyeong Won Yun, Yongin-si, KR;
Hyun Ho Lee, Gyunggi-do, KR;
Jeong Hoon Park, Gyunggi-do, KR;
Gi Ho Jeong, Busan, KR;
Jae Wook Kwon, Seoul, KR;
Dong Jin Kim, Seoul, KR;
Yoon Tak Yang, Hwaseong-si, KR;
Hyeong Won Yun, Yongin-si, KR;
Hyun Ho Lee, Gyunggi-do, KR;
Jeong Hoon Park, Gyunggi-do, KR;
Samsung LED Co., Ltd., Gyunggi-do, KR;
Abstract
Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.