The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Jul. 20, 2007
Dong Sun Kim, Gyunggi-do, KR;
Taehoon Kim, Gyunggi-do, KR;
Jong Seok Song, Seoul, KR;
Sam Jin Her, Gyunggi-do, KR;
Jun Heyoung Park, Gyunggi-do, KR;
Dong Sun Kim, Gyunggi-do, KR;
Taehoon Kim, Gyunggi-do, KR;
Jong Seok Song, Seoul, KR;
Sam Jin Her, Gyunggi-do, KR;
Jun Heyoung Park, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.