The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Mar. 23, 2007
Jun Watanabe, Atsugi, JP;
Yasuo Yamanaka, Machida, JP;
Kiyotaka Sawada, Atsugi, JP;
Keiji Ueda, Kawasaki, JP;
Yasunori Sugimoto, Atsugi, JP;
Jun Watanabe, Atsugi, JP;
Yasuo Yamanaka, Machida, JP;
Kiyotaka Sawada, Atsugi, JP;
Keiji Ueda, Kawasaki, JP;
Yasunori Sugimoto, Atsugi, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
A method of molding an object with a mold having a transfer face includes the steps of filling, separating, re-melting, re-contacting, cooling, and removing. The filling step fills a thermoplastic material, having a temperature greater than a softening temperature of the thermoplastic material, into a cavity space in the mold having a temperature smaller than the softening temperature of the thermoplastic material. The thermoplastic material comes in contact with the transfer face and is cooled. The separating step separates the transfer face from the thermoplastic material to form a heat-insulating layer between the thermoplastic material and transfer face. The re-melting step re-melts the thermoplastic material with heat energy retained inside the thermoplastic material. The re-contacting step re-contacts the re-melted thermoplastic material to the transfer face. The cooling step cools the thermoplastic material to a temperature smaller than the softening temperature of the thermoplastic material. The removing step removes the cooled thermoplastic material from the mold.