The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Aug. 28, 2006
Applicants:
Naohiro Takashima, Fukui, JP;
Shoji Hoshitoku, Fukui, JP;
Takasi Oobayasi, Osaka, JP;
Mituru Harada, Osaka, JP;
Inventors:
Naohiro Takashima, Fukui, JP;
Shoji Hoshitoku, Fukui, JP;
Takasi Oobayasi, Osaka, JP;
Mituru Harada, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.