The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Sep. 06, 2007
Kazuo Okamoto, Fukuoka, JP;
Syoichi Nishi, Fukuoka, JP;
Takeshi Morita, Fukuoka, JP;
Masanori Hiyoshi, Fukuoka, JP;
Kazuhiko Tomoyasu, Fukuoka, JP;
Kazuo Okamoto, Fukuoka, JP;
Syoichi Nishi, Fukuoka, JP;
Takeshi Morita, Fukuoka, JP;
Masanori Hiyoshi, Fukuoka, JP;
Kazuhiko Tomoyasu, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic componentwith a plurality of solder bumpsformed on a lower surface on a board, a filmhaving a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump