The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Nov. 06, 2007
Applicant:
Tsuyoshi Shintate, Sakata, JP;
Inventor:
Tsuyoshi Shintate, Sakata, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing an electronic substrate including an electronic component bonded with adhesive to a base part, comprises (a) applying a droplet containing the adhesive to an area on the base part, the area facing to the electronic component, within a range substantially equal to a size of the electronic component by using a droplet ejection head moving in relatively to the base part, and (b) mounting the electronic component on the adhesive applied to the base part.