The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Dec. 07, 2007
Wei Feng, Shenzhen, CN;
Wenge HU, Shenzhen, CN;
Jingjun Fu, Shenzhen, CN;
Hui Zhao, Shenzhen, CN;
Fang Liu, Shenzhen, CN;
Wei Feng, Shenzhen, CN;
Wenge Hu, Shenzhen, CN;
Jingjun Fu, Shenzhen, CN;
Hui Zhao, Shenzhen, CN;
Fang Liu, Shenzhen, CN;
BYD Company Limited, Shenzhen, CN;
Abstract
This invention discloses a type of image signal sampling circuits and methods. The circuit includes: a signal acquisition unit, a column read out unit, and a working module control circuit. The control circuit includes: a control unit, a source column switch group, a ground column switch group, and a between-column switch group. Each sampling column circuit is equipped with a source column switch and a ground column switch. The source column switch is connected between the inputs of the signal source and the signal acquisition unit. The ground column switch is connected between the ground and the bottom of the signal acquisition unit. The input of the column read out unit is connected to the input of the signal acquisition unit and the output is used to send out the sampled signal. A between-column switch is installed between the input of a front column signal acquisition unit and the bottom of a back signal acquisition unit. The control unit is used to control the switch in each switch group for connected or disconnected operation according to the sampling working module. Employing this invention can realize gain in the image sensor signal, improvement with circuit structure, achieving minimal chip area, and lowered cost.