The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Dec. 26, 2006
Makoto Watanabe, Saitama, JP;
Makoto Watanabe, Saitama, JP;
Nihon Dempa Kogyo Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a two-frequency switchover type crystal oscillator in which first and second IC chips and first and second crystal resonators are connected to wiring patterns of a circuit substrate to form first and second oscillation circuits, and the first and second oscillation circuits are selectively operated in accordance with a selection mechanism; a two-frequency switchover type crystal oscillator in which surfaces opposite to circuit function surfaces of the first and second IC chips are connected to form a two-stage structure; IC terminals of the circuit function surface of the first IC chip are directly connected both electrically and mechanically to the wiring patterns; and IC terminals of the circuit function surface of the second IC chip are connected electrically by wire bonding to the wiring patterns; wherein those wiring patterns of the wiring patterns that are connected to power source, output, and ground terminals of the first and second IC chips are connected in common with respect to the first and second oscillation circuits. This configuration reduces the mounting surface area of the first and second IC chips, facilitating the wiring patterns thereof, thus making it possible to provide a two-frequency switchover oscillator in which the surface area of the external plan view is reduced.