The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Feb. 04, 2008
Semiconductor device including a coupling region which includes layers of aluminum and copper alloys
Takekazu Tanaka, Kanagawa, JP;
Kouhei Takahashi, Kanagawa, JP;
Seiji Okabe, Kanagawa, JP;
NEC Electronics Corporation, Kawasaki, Kanagawa, JP;
Abstract
An improved reliability in a region of a junction between a bonding wire and an electrode pad at higher temperature is achieved. A semiconductor deviceincludes a semiconductor chip, AlCu pads, which are provided in the semiconductor chipand which contain Al as a major constituent and additionally contain copper (Cu), and CuP wires, which function as coupling members for connecting inner leadsprovided outside of the semiconductor chipwith the semiconductor chip, and primarily contain Cu. The AlCu padsand the CuP wiresare encapsulated with an encapsulating resinthat contains substantially no halogen.