The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
May. 27, 2008
Katsuhide Ohtani, Settsu, JP;
Tsuyoshi Ono, Settsu, JP;
Haruhisa Masuda, Settsu, JP;
Ron Klein, Orangeburg, NY (US);
Masakazu Irie, Ichihara, JP;
Kazuo Kobayashi, Ichihara, JP;
Igor Chorvath, Midland, MI (US);
Tatyana Collins, Midland, MI (US);
Lauren Tonge, Midland, MI (US);
Katsuhide Ohtani, Settsu, JP;
Tsuyoshi Ono, Settsu, JP;
Haruhisa Masuda, Settsu, JP;
Ron Klein, Orangeburg, NY (US);
Masakazu Irie, Ichihara, JP;
Kazuo Kobayashi, Ichihara, JP;
Igor Chorvath, Midland, MI (US);
Tatyana Collins, Midland, MI (US);
Lauren Tonge, Midland, MI (US);
Dow Corning Corporation, Midland, MI (US);
Dow Corning Toray Co., Ltd., Tokyo-to, JP;
Daikin Industries, Ltd., Osaka-fu, JP;
Daikin America, Inc., Orangeburg, NY (US);
Abstract
The present invention relates to a fluorine-containing resin composition for molding comprising a fluorine-containing resin (A) and a hydrofluoric acid scavenger (B), in which the hydrofluoric acid scavenger (B) is organopolysiloxane. According to the present invention, a fluorine-containing resin composition which can reduce an amount of hydrofluoric acid released from a fluorine-containing resin and inhibits corrosiveness can be provided.