The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Jul. 05, 2006
Tatsuhiko Asakawa, Fujimi-cho, JP;
Shuichi Tanaka, Chino, JP;
Hideo Imai, Shimosuwa-machi, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device comprises (a) forming a resin layer that includes at least a plurality of a first and a second resin parts, being separated from each other, over a semiconductor substrate having an electrode pad and a passivation film; (b) forming a resin projection in which the first and the second resin parts are integrated by curing the resin layer; and (c) forming a conductive layer that is being connected electrically to the electrode pad and extending over the resin projection, wherein in process (a), the second resin part is formed at least between the electrode pad and the first resin part at a width less than the first resin part.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile