The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Jul. 10, 2006
Applicants:
Josef Willer, Riemerling, DE;
Nicolas Nagel, Dresden, DE;
Inventors:
Josef Willer, Riemerling, DE;
Nicolas Nagel, Dresden, DE;
Assignee:
Qimonda AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing at least one NAND-coupled semiconductor component is disclosed. A layer structure is formed on or above a semiconductor substrate. The layer structure is patterned to expose at least one region to be doped. The exposed region is doped and annealed. The patterned layer structure is at least partially removed. Replacing material is formed in the region in which the patterned layer structure has been removed, thereby forming the at least one NAND-coupled semiconductor component.