The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Dec. 10, 2007
David R. Scheid, Eau Claire, WI (US);
David R. Scheid, Eau Claire, WI (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
A method for producing flexible semiconductor assemblies is described. For example, an integrated circuit package consisting of an X-Y axes sensor die and a Z-axis sensor die disposed at 90 degrees to each other may be formed by applying a flexible dielectric membrane to a semiconductor wafer, creating bending gaps between the sensor dice, singulating the IC package from the wafer, and bending the flexible dielectric membrane so that the sensor dice are disposed orthogonally to each other. This method eliminates the need to precisely position previously singulated sensor dice relative to each other in order to apply a flexible dielectric membrane for purposes of interconnecting the dice.