The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Apr. 21, 2005
Satoru Ishigaki, Kawasaki, JP;
Hiroshi Uchida, Kawasaki, JP;
Yoshio Miyajima, Kawasaki, JP;
Katsutoshi Morinaka, Fukushima, JP;
Satoru Ishigaki, Kawasaki, JP;
Hiroshi Uchida, Kawasaki, JP;
Yoshio Miyajima, Kawasaki, JP;
Katsutoshi Morinaka, Fukushima, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1):CH═CH—COO—R—NCO  (1)(wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).