The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2010
Filed:
Jan. 27, 2009
Applicants:
Hiroshi Sugimura, Tokyo, JP;
Gaku Suzuki, Tokyo, JP;
Masahiro Ueno, Tokyo, JP;
Yoshihiro Kodama, Tokyo, JP;
Takao Tomono, Tokyo, JP;
Inventors:
Hiroshi Sugimura, Tokyo, JP;
Gaku Suzuki, Tokyo, JP;
Masahiro Ueno, Tokyo, JP;
Yoshihiro Kodama, Tokyo, JP;
Takao Tomono, Tokyo, JP;
Assignees:
Toppan Printing Co., Ltd., Tokyo, JP;
Hisamitsu Pharmaceutical Co., Inc., Saga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 19/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a microneedle including the steps of forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding, and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding.