The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2010

Filed:

Aug. 19, 2008
Applicants:

Stephen John Sleijpen, Balmain, AU;

Joseph Tharion, Balmain, AU;

Jan Waszczuk, Balmain, AU;

Eric Patrick O'donnell, Balmain, AU;

William Granger, Balmain, AU;

David Bernardi, Balmain, AU;

Stephen Richard O'farrell, Balmain, AU;

Jason Mark Thelander, Balmain, AU;

Inventors:

Stephen John Sleijpen, Balmain, AU;

Joseph Tharion, Balmain, AU;

Jan Waszczuk, Balmain, AU;

Eric Patrick O'Donnell, Balmain, AU;

William Granger, Balmain, AU;

David Bernardi, Balmain, AU;

Stephen Richard O'Farrell, Balmain, AU;

Jason Mark Thelander, Balmain, AU;

Assignee:

Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 29/393 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base.


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