The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Mar. 29, 2007
Shin Narushima, Tokyo, JP;
Naoto Matono, Nagano, JP;
Takamitsu Sakamoto, Tokyo, JP;
Noriaki Kasahara, Tokyo, JP;
Koichi Otani, Tokyo, JP;
Shin Narushima, Tokyo, JP;
Naoto Matono, Nagano, JP;
Takamitsu Sakamoto, Tokyo, JP;
Noriaki Kasahara, Tokyo, JP;
Koichi Otani, Tokyo, JP;
TDK Corporation, Tokyo, JP;
SAE Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
A thin film magnetic head is provided, in which thermal protrusion can be suppressed. The thin film magnetic head includes a main magnetic pole layer which conducts a magnetic flux into the recording medium so that the recording medium is magnetized in a direction perpendicular to a surface of the recording medium, a first return yoke layer provided in a trailing side of the main magnetic pole layer, and has a recess in a top surface, a second return yoke layer provided so as to fill at least the recess of the first return yoke layer, and a thermal expansion suppression layer provided in a trailing side of the second return yoke layer. Thus, since the thermal expansion suppression layer can be provided on a surface having no recess, a possibility of a crack in the thermal expansion suppression layer can be eliminated.